Storm Circuit Technology Ltd

Storm Circuit Technology Ltd

0.4mm pitch BGA HDI design with 0.1mm laser drillig via

2018 04/18

We made a lot of such boards this year.below is an example what we did.
HDI board,there are four BGA area and three of four are 0.4mm pitch BGA with 0.1mm laser drilling.
Material:FR4,TG170.
Layer:4
Thickness:0.8mm
Finish:Immersion Gold

Key feature:0.1mm drilling vias,blind vias,via in pad,Impedance control.

laser-drilling

img-3923

img-3918

blind-vias_orig